Product Images Product Images ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P+1P With Switch, PUSH PUSH, H1.29mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Au 1u”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell, Solder: 3USD area:Gold Flash Electrical: Current Rating: 0.5A Voltage Rating: 50V DC Max. Contact Resistance: 100mΩ Max.