ຕົວເຊື່ອມຕໍ່ບັດ Micro SD 4.0 push push KLS1-SD4.0-004
ຂໍ້ມູນຜະລິດຕະພັນ Micro SD 4.0 card connector push push Material: Plastic:LCP,Thermoplastic UL94V-0.Black. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell: ສະແຕນເລດ. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: Au 3u" ຫຼາຍກວ່າ Ni 50u". ພື້ນທີ່ຫາງ Solder: Matted Tin 80u" Min. over Ni 50u". Solderability:Over Plating Ni 50" Over All, Part No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ເວລາສັ່ງ
ຕົວສຽບບັດ Micro SD, H1.28mm, ມີ CD pin KLS1-SD113
ຂໍ້ມູນຜະລິດຕະພັນ Micro SD card connector push push,H1.28mm, with CD pin Material: Insulator:High Temperature Thermoplastic LCP SZ6505,UL94V-0,Black. ຕິດຕໍ່: Berylliun ທອງແດງ (7035-TM06, T = 0.15mm), plated 80u" min Ni ໂດຍລວມ plated 1u" min Au ໃນໄລຍະ Ni ກ່ຽວກັບພື້ນທີ່ solder. Shell:SUS301-3/4H T=0.10mm.Solder tail plated 1u" min Au overll 50u" min Ni. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5A AC/DC ສູງສຸດ. Voltage Rating: 12V AC/DC ລະດັບຄວາມຊຸ່ມຊື່ນສະພາບແວດລ້ອມ: 95% RH ...
ຕົວສຽບບັດ Micro SD, H1.68mm, ມີ CD pin KLS1-SD114
ຂໍ້ມູນຜະລິດຕະພັນ Micro SD card connector push push,H1.68mm, with CD pin Material: Insulator:Hi-Temperature Plastic, UL94V-0,Black. Terminal: ໂລຫະປະສົມທອງແດງ, ແຜ່ນກະພິບທອງໃສ່ພື້ນທີ່ຕິດຕໍ່ & ຫາງ solder. Shell: Stainless Steel, Nickel underplated ສຸດ allover, ກະພິບສີທອງຢູ່ໃນຫາງ solder. ໄຟຟ້າ: Insulation Resistance: 1000MΩ Min./500V DC Withstanding Voltage: 250V AC/ນາທີ. Contact Resistance: 100mΩ Max.AT 20mA/20mV Max Current Rating: 0.5 A ແຮງດັນໄຟຟ້າ...
ຕົວສຽບບັດ Micro SD, H1.85mm, ເປີດປົກກະຕິ KLS1-SD107
ຂໍ້ມູນຜະລິດຕະພັນ Micro SD card connector push push,H1.85mm,ປົກກະຕິເປີດໄຟຟ້າ: ຕິດຕໍ່ rating ໃນປັດຈຸບັນ: 0.5A Max. ຕ້ານການຕິດຕໍ່: 100mΩ Max. Insulation Resistance: 250V DC ຫຼື 300V AC ສໍາລັບການບໍ່ຫນ້ອຍກ່ວາ 1 ນາທີ Mating ຄວາມທົນທານ: 10000 Cycles Min. ແຮງແຊກ: 2.0kgf ສູງສຸດ. ແຮງສະກັດ: 0.5kgf min. ອຸນຫະພູມປະຕິບັດການ: -25ºC~+85ºC ພາກທີ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ຄໍາສັ່ງເວລາ
ຕົວເຊື່ອມຕໍ່ບັດ Micro SD ດຶງ, H1.5mm, ກັບ CD pin KLS1-SD104
ຂໍ້ມູນຜະລິດຕະພັນ Micro SD card connector push pull,H1.5mm, with CD pin Notes: Coplanarty spec.For all solder tails and solder pads is 0.1mm max. ລັກສະນະໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5 Amp.MAX. ແຮງດັນ: 100V DC.MAX ລະດັບຕ່ໍາການຕິດຕໍ່ Resistance: 100mΩ Max.Initially. Dielectric Withstanding Voltage: 500V AC MIN.For 1 ນາທີ. Insulation Resistance:(ເບື້ອງຕົ້ນ)1000MΩ Min.(ສຸດທ້າຍ)100MΩ Min. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ + 105ºC ທົນທານ...
ຕົວເຊື່ອມຕໍ່ໃສ່ຊິມກາດຄູ່, ສຽບ PULL, H3.0mm KLS1-SIM2-002A
ຂໍ້ມູນຜະລິດຕະພັນ Double SIM Card Connector, PUSH PULL, H3.0mm ວັດສະດຸ: ເຮືອນ: Hi-TEMP Plastic, UL94V-0.Black. Terminal:ໂລຫະປະສົມທອງແດງ Shell: Stainless Steel Finish: Terminal:Au plated on the contact area, Matte tin plated on the solder tails underplated over nickel Shell:Au plated on the solder tails underplated over nickel Electrical: Contact Resistance: 50mΩ Max Withstanding Voltage: 350V. ຄວາມຕ້ານທານ: 1000M & Om ...
2 ໃນ 1 ຕົວເຊື່ອມຕໍ່ Micro SIM & SD Card, 8P,H2.26mm KLS1-SIM-109
ຂໍ້ມູນຜະລິດຕະພັນ 2 ໃນ 1 ຕົວເຊື່ອມຕໍ່ Micro SIM & SD Card, 8P,H2.26mm Material: Insulator:High Temp Thermoplastic,UL94V-0.Black. Terminal: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງໃນພື້ນທີ່ຕິດຕໍ່ 1u", Solering Area gilding 1u" ຊັ້ນເທິງ Shell: Stainless Steel, Plate Nickel 50u". Shell ລົງ: SUS304 R-1/2H T = 0.10mm, Plate Nickel 50u". ໄຟຟ້າ: Insertion Force 1kgf Max.Withdrawal Force 0.1kgf Min. ຄວາມທົນທານ: SIM 5000 ຮອບ, ການຕິດຕໍ່ Resistance: ກ່ອນທີ່ຈະທົດສອບ 8 ...
ຕົວເຊື່ອມຕໍ່ໃສ່ຊິມກາດຄູ່, PUSH PULL, H3.0mm KLS1-SIM-033
ຂໍ້ມູນຜະລິດຕະພັນ Double SIM Card Connector, PUSH PULL, H3.0mm ວັດສະດຸ: ເຮືອນ: Hi-Temperature Plastic, UL94V-0.Black. Terminal: Copper Alloy.Gold Flash Plated On All terminal, AND 50u" min nickel underplated on Allover. Shell:Stainless Steel.50u" Nickel underplated on Allover, Gold Flash on Solder PAD. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5 A. ລະດັບແຮງດັນ: 5.0 vrms. Insulation Resistance: 1000MΩ Min.At DC500V DC. ແຮງດັນໄຟຟ້າທົນ: 250V AC RMS ສໍາລັບ 1 ...
ຊິມກາດ 2 ໃນ 1 + ຕົວເຊື່ອມຕໍ່ Micro SD, PUSH PULL, H2.7mm KLS1-SIM-024
ຂໍ້ມູນຜະລິດຕະພັນ 2 ໃນ 1 ຊິມກາດ + Micro SD Connector, PUSH PULL, H2.7mm ໄຟຟ້າ: ແຮງດັນ: 100V AC ປັດຈຸບັນ: 0.5A Max. ຕ້ານການຕິດຕໍ່: 100mΩ Max. Dielectric Withstanding Voltage: 500V AC. Insulation Resistance: 1000MΩ ກົນຈັກຫນ້ອຍ: Card Insertion ຖອນ Force: 13.8N Max. ແຮງດັນ: 19.6N ສູງສຸດທີ່ເຄຍ. ຄວາມທົນທານ: 10000 ຮອບ. ອຸນຫະພູມປະຕິບັດການ: -45ºC~+85ºC ພາກສ່ວນ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ເວລາ...
Nano SIM Card Connector;PUSH PULL,6Pin,H1.40mm KLS1-SIM-113
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector;PUSH PULL,6Pin,H1.40mm Material: Insulator:LCP,UL94V-0. ຕິດຕໍ່:C5210.Plated 50u" Ni ໂດຍລວມ, ຕິດຕໍ່ທັງຫມົດ Au 1u. Shell:SUS,Plated 50u" Ni ໂດຍລວມ,PAD Au 1u. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5A AC/DC ສູງສຸດ. ລະດັບແຮງດັນ: 30V AC / DC Contact Resistance: 30mΩ Max. Insulation Resistance:1000MΩ ອຸນຫະພູມຕໍ່າສຸດ: -45ºC~+85ºC ພາກທີ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty...
Nano SIM Card Connector, PUSH PUSH, 6Pin, H1.37mm, ມີ CD Pin KLS1-SIM-066
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, PUSH PUSH, 6Pin, H1.37mm, with CD Pin Material: Insulator: High Temperature Thermoplastic, UL94V-0. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນ 50u" Ni ໂດຍລວມ, PAD Au 1u". Shell:SUS.All Ni 30U/ນາທີ. ໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5A ampers Voltage Rating: 5V AC/DC Contact Resistance: 100mΩ Max. Insulation Resistance:1000MΩ Min./500V DCOperating Temperature: -45ºC~+85ºC Part No. Description PCS/CTN G...
Nano SIM Card Connector, PUSH PUSH, 6Pin, H1.25mm, ມີ CD Pin KLS1-SIM-103
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, PUSH PUSH, 6Pin, H1.25mm, with CD Pin Material: Contact: Copper Alloy.Au over Ni. ທີ່ຢູ່ອາໄສ: LCP ແກ້ວເຕັມ. Shell:Stainless.Au over Ni.GND Frame: Copper Alloy.Au over Ni. ກວດຫາສະວິດ:ໂລຫະປະສົມທອງແດງ.Au over Ni.Slide:ແກ້ວເຕີມ Pa10t. ພາກຮຽນ spring: ສະແຕນເລດ. Hook: ສະແຕນເລດ. ໄຟຟ້າ: Rated Current: 0.5A Max Rated Voltage: 30V AC Contact Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min./500VDC Dielectric Wi...
Nano SIM Card Connector, ປະເພດຖາດ, 6Pin, H1.55mm, ມີ CD Pin KLS1-SIM-104
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, Tray type, 6Pin, H1.55mm, with CD Pin Electrical: Current Rating: 1 Amp/Pin.MAX. ແຮງດັນ: 30V DC.MAX ລະດັບຕ່ໍາການຕິດຕໍ່ Resistance: 30mΩ Max.Initially. Dielectric Withstanding Voltage: 500V AC MIN.For 1 ນາທີ. Insulation Resistance: 100MΩ Min.500V DC .ສໍາລັບ 1 ນາທີ. ຄວາມທົນທານ: 1500 ຮອບ. ອຸນຫະພູມປະຕິບັດການ: -45ºC~+85ºC ພາກສ່ວນ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ເວລາ ຫຼື...
Nano SIM Card Connector, ປະເພດຖາດ, 6Pin, H1.5mm, ມີ CD Pin KLS1-SIM-102
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, Tray type, 6Pin, H1.5mm, with CD Pin Electrical: Current Rating: 1 Amp/Pin.MAX. ແຮງດັນ: 30V DC.MAX ລະດັບຕ່ໍາການຕິດຕໍ່ Resistance: 30mΩ Max.Initially. Dielectric Withstanding Voltage: 500V AC MIN.For 1 ນາທີ. Insulation Resistance: 100MΩ Min.500V DC .ສໍາລັບ 1 ນາທີ. ຄວາມທົນທານ: 1000 ຮອບ. ອຸນຫະພູມປະຕິບັດການ: -45ºC~+85ºC ພາກສ່ວນ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ຄໍາສັ່ງທີ່ໃຊ້ເວລາ ...
Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm, with CD Pin KLS1-SIM-100
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm, with CD Pin Material: Plastics: LCP,UL94V-0.Black. ຕິດຕໍ່:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. ແຜ່ນແພ: ຕິດຕໍ່: ພື້ນທີ່ຕິດຕໍ່: ແຜ່ນ G/F; ພື້ນທີ່ Soldertail: 80u" Matte Tin Shell: Plating over 30u" NiSolderable 30u" Ni Plating over all.Contact and tail coplanarity to be 0.10mm. Part No. Description PCS/CTN GW(KG) CMBQty Time Order.
Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, ມີ CD Pin KLS1-SIM-101
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, with CD Pin Material: Housing: High Temperature Thermoplastic, UL94V-0.Black. Terminal: ໂລຫະປະສົມທອງແດງ, ທອງ Plated ເທິງພື້ນທີ່ຕິດຕໍ່ແລະຫາງ solder, underplated Nickel ຫຼາຍກວ່າທັງຫມົດ. Shell: ສະແຕນເລດ, ຄໍາ plated ເທິງຫາງ solder, underplated Nickel ຫຼາຍກວ່າທັງຫມົດ. ໄຟຟ້າ: Rated Current: 0.5A Max Rated Voltage: 30V AC Contact Resistance: 100mΩ Max. ຄວາມຕ້ານທານ insulation: 1000MΩ Min./500V...
Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, ມີ CD Pin KLS1-SIM-077A
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, with CD Pin Material: Insulator: High Temperature Thermoplastic, UL94V-0. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ເຄືອບ 50u" Ni ໂດຍລວມ ຕິດຕໍ່ທັງຫມົດ Au 1U. Shell:SUS.All Ni 30U MIN. ໄຟຟ້າ: ອັດຕາປັດຈຸບັນ: 0.5A AC/DC MAX. ລະດັບແຮງດັນ: 125V AC/DC ລະດັບຄວາມຊຸ່ມຊື່ນອາກາດລ້ອມຮອບ: 95% Ω ສູງສຸດ RH ຕິດຕໍ່ Resistance: 80 m. Min./100V DC Mating Cycles: 5000 Insertions.
Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, ບໍ່ມີ CD Pin KLS1-SIM-077
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, 6Pin, H1.4mm, Hinged Type, without CD Pin Material: Insulator: High Temperature Thermoplastic, UL94V-0. ຕິດຕໍ່:C5210,Plated 50u" Ni ໂດຍລວມ ຕິດຕໍ່ທັງຫມົດ Au 1U. Shell:SUS.All Ni 30U/MIN. ໄຟຟ້າ: Rating Current: 0.5A Voltage Rating:5V AC/DC Ambient Humidity Range:95% RH Max. Contact Resistance: 80mΩ Max. Insulation Resistance: 80mΩ Max. Insulation Resistance: 80mΩ Max. ຮອບວຽນການຫາຄູ່: 10000 Insertions.Operating Temperature: -45&...
Nano SIM Card Connector, PUSH PULL, 6Pin, H1.4mm, ມີ CD Pin KLS1-SIM-092
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, PUSH PULL, 6Pin, H1.4mm, with CD Pin Material: Housing:Hi-Temperature Thermoplastic, UL94V-0.Black. Terminal: ໂລຫະປະສົມທອງແດງ, ເລືອກ 1u "Au ໃນພື້ນທີ່ຕິດຕໍ່. Shell: Stainless Steel.selective Gold Flash ຢູ່ໃນພື້ນທີ່ solder. ໄຟຟ້າ: ປະຈຸບັນ Rated: 0.5A ສູງສຸດທີ່ເຄຍແຮງດັນ: 30V AC Contact Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Voltage / AC50V Min./500V. ຄວາມທົນທານ: 5000...
Nano SIM Card Connector;PUSH PULL,6Pin,H1.35mm KLS1-SIM-076
ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector;PUSH PULL,6Pin,H1.35mm Material: Insulator:High Temperature Thermoplastic, UL94V-0. ຕິດຕໍ່:C5210.Plated 50u" Ni ໂດຍລວມ, ຕິດຕໍ່ທັງຫມົດ Au 1u. Shell:SUS,Plated 50u" Ni ໂດຍລວມ,PAD Au 1u. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5A AC/DC ສູງສຸດ. ລະດັບແຮງດັນ: 125V AC / DC Contact Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min.500V DCOperating Temperature: -45ºC~+85ºC Part No. Description...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8Pin H1.5mm, Hinged ປະເພດ KLS1-SIM-089
ຂໍ້ມູນຜະລິດຕະພັນ Micro SIM Card Connector, 8Pin H1.5mm, Hinged ປະເພດວັດສະດຸທີ່ຢູ່ອາໄສ: Thermoplastic, UL94V-0. Terminal: Phosphor Bronze, T=0.15, NiPlated ພາຍໃຕ້, Au plated On ContactArea, G/F plated on Soldertail. Shell: Stainless Steel, T=0.15, Ni Plated Under, G/F plated on Soldertail. ຕ້ານການຕິດຕໍ່ໄຟຟ້າ: 60mΩ Max. ຄວາມຕ້ານທານຂອງ insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC ສໍາລັບ 1 ນາທີ. ຄວາມທົນທານ: 5000 ຮອບ. ອຸນຫະພູມການດໍາເນີນງານ: ...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.8mm, Hinged ປະເພດ KLS1-SIM-072
ຂໍ້ມູນຜະລິດຕະພັນ Micro SIM Card Connector, 6Pin H1.8mm, Hinged ປະເພດວັດສະດຸ: ທີ່ຢູ່ອາໄສ: LCP, UL94V-0, ສີດໍາ. ສະຖານີ: ໂລຫະປະສົມທອງແດງ. Shell: ສະແຕນເລດ. ກະແສໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 1A Max. ລະດັບແຮງດັນ: 30V DC ສູງສຸດທີ່ເຄຍ. ຕ້ານການຕິດຕໍ່: 30mΩ Max. ຄວາມຕ້ານທານຂອງ insulation: 1000MΩ Min. ແຮງດັນໄຟຟ້າ: 500V rms / min. ຄວາມທົນທານ: 5000 ຮອບ. ອຸນຫະພູມປະຕິບັດການ: -45ºC~+85ºC ພາກສ່ວນ No. Description PCS/CTN GW(KG) CMB(m3) OrderQty. ...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.5mm, ປະເພດຖາດ KLS1-SIM-075
ຂໍ້ມູນຜະລິດຕະພັນ Micro SIM Card Connector, 6Pin H1.5mm, ປະເພດຖາດວັດສະດຸ: Insulator: Hi-Temperature Plastic, UL94V-0, ສີດໍາ. Terminal: Copper Alloy.Gold Flash Plating on allterminal,Aad 50u" min Nickel underplated on allover. Shell: 50u" Nickel underplated on allover, Gold flash onsolder pad. ໄຟຟ້າ: Rating Current: 0.5A Voltage Rating Voltage: 5.0 vrms Insulation Resistance: 1000MΩ Min./500V DC Withstanding Voltage: 250V ACrms ສໍາລັບ 1 ນາທີ ...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P, Push PULL, H1.5mm KLS1-SIM-099
ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P, PUSH PULL, H1.5mm ວັດສະດຸທີ່ຢູ່ອາໄສ: Thermoplastic, UL94V-0. Terminal: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງຢູ່ໃນພື້ນທີ່ຕິດຕໍ່ແລະຫາງ solder, ແຜ່ນ Nickel ໂດຍລວມ. Shell:Stainless Steel.Nickel Plated ໂດຍລວມ.GoldPlated ສຸດ Solder Tails. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 1.0 A ສູງສຸດທີ່ເຄຍ. ຕ້ານການຕິດຕໍ່: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000MΩ Min./500V DC ອຸນຫະພູມປະຕິບັດງານ: -45ºC ~ +8...- English
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