Product Images Product Images ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P+1P With Switch, PUSH PUSH, H1.29mm Material: Housing: High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Au 1u”, Solder area: Gold Flash; Under plate Ni 40u” Min all over Shell, Solder: 3USD area:Gold Flash Electrical: Current Rating: 0.5A Voltage Rating: 50V DC Max. Contact Resistance: 100mΩ Max.
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector, PUSH PUSH, 6Pin, H1.37mm, with CD Pin Material: Insulator: High Temperature Thermoplastic, UL94V-0. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນ 50u” Ni ໂດຍລວມ, PAD Au 1u”. Shell:SUS.All Ni 30U/ນາທີ. ໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 0.5A ampers Voltage Rating: 5V AC/DC Contact Resistance: 100mΩ Max. Insulation Resistance: 1000MΩ Min./500V DC ອຸນຫະພູມການດໍາເນີນງານ: -45ºC~+85ºC
Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm, with CD Pin KLS1-SIM-100
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ Nano SIM Card Connector;MID Mount Tray type,6Pin,H1.5mm, with CD Pin Material: Plastics: LCP,UL94V-0.Black. ຕິດຕໍ່:C5210 Shell:SUS304 Tray:LCP,UL94V-0.Black. ແຜ່ນແພ: ຕິດຕໍ່: ພື້ນທີ່ຕິດຕໍ່: ແຜ່ນ G/F; ພື້ນທີ່ Soldertail: 80u” Matte Tin Shell: Plating over 30u” Ni Solderable 30u” Ni Plating over all.Contact and tail coplanarity to be 0.10mm all.