ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.42mm KLS1-SIM-105
Product Images Product Images Product Information Connector Micro SIM Card, 6Pin H1.42mm Material: Insulator:High Temperature Thermoplastic, UL 94V-0 Contact: Copper Alloy,Plated 50u” Ni Ooverall Contact Au 1U Shell:SUS,Plated 50u” Ni Ooverall,Characive Selecter 1u” ພື້ນທີ່ຕິດຕໍ່ໄຟຟ້າ rating: 0.5mA AC/DC ລະດັບແຮງດັນສູງສຸດ: 125V AC/DC ຊ່ວງອຸນຫະພູມແວດລ້ອມອ້ອມຂ້າງ:-20°C~+60°C ຊ່ວງອຸນຫະພູມການເກັບຮັກສາ:-40°C~+70°C ຊ່ວງຄວາມຊຸ່ມຊື່ນລ້ອມຮອບ: 95% RH ສູງສຸດ ຕິດຕໍ່ Resi...
Micro SIM Card CONN,6P,H1.45mm,SMD KLS1-SIM-046
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ: ທີ່ຢູ່ອາໃສ: LCP, UL94V-0 ຕິດຕໍ່: C5210 , Gold Flash Plated ໃນພື້ນທີ່ຕິດຕໍ່; Gold Flash Plating On Solder Tails; ດ້ວຍ Entrre Contact Underplated Nickel Shell:SUS304,Nickel Underplated Overall, Gold Flash Plated On Solder Tails ElectricaL SpecificaTions: Current Rating: 0.5A Voltage Rating: 5V Contact Resistance: 50mΩ Max. ຄວາມຕ້ານທານ insulation: 1000MΩ Min Durabiliy: 3000 Cycles Min
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8Pin H1.5mm, Hinged ປະເພດ KLS1-SIM-089
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8Pin H1.5mm, Hinged ປະເພດ ວັດສະດຸທີ່ຢູ່ອາໄສ: Thermoplastic, UL94V-0. Terminal: Phosphor Bronze, T = 0.15, Ni plated ພາຍໃຕ້, Au Plated ໃນພື້ນທີ່ຕິດຕໍ່, G / F plated ສຸດ soldertail. Shell: Stainless Steel, T=0.15, Ni Plated Under, G/F plated on Soldertail. ຕ້ານການຕິດຕໍ່ໄຟຟ້າ: 60mΩ Max. ຄວາມຕ້ານທານຂອງ insulation: 1000MΩ Min. Dielectric Withstanding Voltage: 500V AC ສໍາລັບ 1 ນາທີ. ຄວາມທົນທານ: 5000 ຮອບວຽນ. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ +85ºC
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.8mm, Hinged ປະເພດ KLS1-SIM-072
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.8mm, Hinged type Material: Housing: LCP,UL94V-0,Black. ສະຖານີ: ໂລຫະປະສົມທອງແດງ. Shell: ສະແຕນເລດ. ກະແສໄຟຟ້າ: ອັດຕາປັດຈຸບັນ: 1A Max. ລະດັບແຮງດັນ: 30V DC ສູງສຸດທີ່ເຄຍ. ຕ້ານການຕິດຕໍ່: 30mΩ Max. ຄວາມຕ້ານທານຂອງ insulation: 1000MΩ Min. ແຮງດັນໄຟຟ້າ: 500V rms / min. ຄວາມທົນທານ: 5000 ຮອບວຽນ. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ +85ºC
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.5mm, ປະເພດຖາດ KLS1-SIM-075
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6Pin H1.5mm, ປະເພດຖາດວັດສະດຸ: Insulator:Hi-Temperature Plastic, UL94V-0,Black. Terminal: Copper Alloy.Gold Flash Plating on all terminal,Aad 50u” min Nickel underplated on allover. Shell: 50u” Nickel Underplated on allover,Gold flash on solder pad. ໄຟຟ້າ: Rating Current: 0.5A Voltage Rating Voltage: 5.0 vrms Insulation Resistance: 1000MΩ Min./500V DC Withstanding Voltage: 250V ACrms For 1Minute Contact Res...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P, Push PULL, H1.5mm KLS1-SIM-099
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P, PUSH PULL, H1.5mm ວັດສະດຸທີ່ຢູ່ອາໄສ: Thermoplastic, UL94V-0. ສະຖານີ: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງຢູ່ໃນພື້ນທີ່ຕິດຕໍ່ແລະຫາງ solder, ແຜ່ນ Nickel ໂດຍລວມ. Shell:Stainless Steel.Nickel Plated ໂດຍລວມ.GoldPlated ສຸດ Solder Tails. ກະແສໄຟຟ້າ: ອັດຕາຄ່າກະແສໄຟຟ້າ: 1.0 A ສູງສຸດທີ່ເຄຍ. ຕ້ານການຕິດຕໍ່: 30mΩ Max. Dielectric Withstanding Voltage: 500V AC Insulation Resistance: 1000MΩ ຕ່ໍາສຸດ / 500V DC ອຸນຫະພູມການດໍາເນີນງານ: -45ºC ~ + 85ºC
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P, Push PULL, H1.5mm KLS1-SIM-091
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P, PUSH PULL, H1.5mm Electrical: Rated Current: 1.0A Rated Voltage: 30V Contact Resistance: 50mΩ Max. Insulation Resistance: 1000MΩ Min./500V DC Dielectric Withstanding Voltage: 500V AC Solder abiltiy: 250oC~%%P5oC,10%%P0.5s ຄວາມທົນທານ: 5000 ຮອບວຽນຕໍ່າສຸດ. ການຕໍ່ຕ້ານການຕິດຕໍ່: 50mΩ Max. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ +85ºC
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P
ຮູບພາບຜະລິດຕະພັນ
ຕົວເຊື່ອມຕໍ່ Micro SIM Card; PUSH PUSH, 6P+1P ຫຼື 8P+1P, H1.50mm KLS1-SIM-090
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card;PUSH PUSH,6P+1P ຫຼື 8P+1P,H1.50mm ລະດັບກະແສໄຟຟ້າ: 0.5A ລະດັບແຮງດັນ: 5.0 vrms ຄວາມຕ້ານທານຕິດຕໍ່: 100mΩ Max. ຄວາມຕ້ານທານ insulation: 1000M Min. ແຮງດັນໄຟຟ້າທົນ: 250V ACrms ສໍາລັບ 1 ນາທີ. ໄລຍະການໃຊ້ງານ:-45℃-+105℃ ວັດສະດຸ: insulatator: Hi-Temperature plastic, UL94V-0, Black terminal: Copper Alloy, Gold Flash Plating on all terminal, and 50u” min nickel underplated on allover. Shell: Stainless Steel, 50u&...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card; PUSH PUSH, 6P ຫຼື 6P+1P, H1.35mm KLS1-SIM-069
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card; PUSH PUSH, 6P ຫຼື 6P+1P, H1.35mm, ໂດຍບໍ່ມີການໄປສະນີ. ວັດສະດຸ: Insulator:High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U” Ni Overall Contact Au 1U Shell:SUS,Plated 50U” Ni Overall Plated 1u” Au Selective Contact Area Electrical: Current Rating: 0.5A Max. 5V Voltage Contact Rating/DC. Insulation Resistance: 1000M Min./500VDC ຊ່ວງຄວາມຊຸ່ມຊື່ນສະພາບແວດລ້ອມ: 95% RH Max.
ຕົວເຊື່ອມຕໍ່ Micro SIM Card 8P, Push PULL, H2.4mm KLS1-SIM-044-8P
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຊ່ອງສຽບ Micro SIM Card 8P, PUSH PULL, H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. ຂໍ້ມູນຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງ. Shell: Stainless Steel, Gold Plated. ໄຟຟ້າ: Contact Resistance: 50mΩ ປົກກະຕິ, 100Ω Max. ຄວາມຕ້ານທານ insulation:> 1000MΩ / 500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow:250ºC.5sec.ສູງສຸດ. ການເຊື່ອມໂລຫະດ້ວຍມື: 370ºC.3sec.Max. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ + 105ºC
ຕົວເຊື່ອມຕໍ່ Micro SIM Card 6P, Push PULL, H2.4mm KLS1-SIM-044-6P
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ Micro SIM Card Connector 6P, PUSH PULL, H2.4mm Material: Base:Hi-Temp Thermoplastic,UL94V-0.Black. ຂໍ້ມູນຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງ. Shell: Stainless Steel, Gold Plated. ໄຟຟ້າ: Contact Resistance: 50mΩ ປົກກະຕິ, 100Ω Max. ຄວາມຕ້ານທານ insulation:> 1000MΩ / 500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow:250ºC.5sec.ສູງສຸດ. ການເຊື່ອມໂລຫະດ້ວຍມື: 370ºC.3sec.Max. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ + 105ºC
ຕົວເຊື່ອມຕໍ່ SIM; PUSH PUSH, 6P + 2P, H1.80mm, ມີໄປສະນີຫຼືບໍ່ມີໄປສະນີ. KLS1-SIM-110
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ຊິມກາດ;ຍູ້ PUSH, 6P+2P, H1.80mm ມີໂພສ ຫຼືບໍ່ມີໂພສ. ວັດສະດຸ: ວັດສະດຸທີ່ຢູ່ອາໄສ: LCP UL94V-0 Contact Material: Tin-Bronze Package: Tape and Reel Package Electrical ຄຸນລັກສະນະ: Voltage rating: 100V AC Current Rating: 0.5A Max Withstand voltage: 250V AC/1Minute Insulation resistance: ≥1000Μ 0 Contact Life ອຸນຫະພູມການເຮັດວຽກຂອງຮອບວຽນ: -45ºC~+85ºC
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 8P+1P, H1.9mm, ກັບ Post KLS1-SIM-108
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P+1P, H1.9mm, with Post Material: Housing: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell: ໂລຫະປະສົມທອງແດງ. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: ກະພິບທອງ. ພື້ນທີ່ solder: 80u” min, ໂລຫະປະສົມກົ່ວ Matte plated. ພາຍໃຕ້ແຜ່ນ: 30u” min, Nickel. Shell: 30u” Min, Nickel plated ໂດຍລວມ ພື້ນທີ່ Solder: Gole flash. ໄຟຟ້າ: Rating Current: 0.5A. Withstanding Voltage: AC500V rms Insulation Resistance: 1000MΩMin, At DC 500V Contact R...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P+1P, H1.9mm, ກັບ Post KLS1-SIM-107
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P+1P, H1.9mm, with Post Material: Housing: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell: ໂລຫະປະສົມທອງແດງ / ເຫຼັກກ້າ. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: ກະພິບທອງ. ພື້ນທີ່ solder: 80u” min, ໂລຫະປະສົມກົ່ວ Matte plated. ພາຍໃຕ້ແຜ່ນ: 30u” min, Nickel. Shell: 30u” Min, Nickel plated ໂດຍລວມ ພື້ນທີ່ Solder: Gole flash. ໄຟຟ້າ: Rating Current: 0.5A. Withstanding Voltage: AC500V rms Insulation Resistance: 1000MΩMin, At DC 500V Cont...
ຕົວເຊື່ອມຕໍ່ SIM; PUSH PUSH, 6P, H1.85mm KLS1-SIM-106
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P,H1.85mm, with Post Housing: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell:SUS. ສໍາເລັດຮູບ: Gold plated ເທິງພື້ນທີ່ conatct, Tin plated ສຸດຫາງ solder.
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-087
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P, H1.85mm, ບໍ່ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u” min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u” min Tin on solder Tail. Shell: 50u” Nickel Underplated on Allover,Gold flash on solder Latch. ໄຟຟ້າ: ປະຈຸບັນ rating: 0.5A. Voltage Rating: 5.0 Vrms. Insulation Resistance: 500...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-086
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u” min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u” min Tin on solder Tail. Shell: 50u” Nickel Underplated on Allover,Gold Flash on Solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. Voltage Rating: 5.0 Vrms. Insulation Resistance:...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-085A
ຮູບພາບຜະລິດຕະພັນ ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u” min Nickel Underplated on Allover, Gold Plating on Contact Arer,80u” min Tin on solder Tail. Shell: 50u” Nickel Underplated on Allover,Gold Flash on Solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. Voltage Rating: 5.0 Vrms. Insulation Resistance...- English
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