ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 8P
ຕົວເຊື່ອມຕໍ່ Micro SIM Card, 6P
P-H1.5-R )
ຕົວເຊື່ອມຕໍ່ Micro SIM Card; PUSH PUSH, 6P+1P ຫຼື 8P+1P, H1.50mm KLS1-SIM-090
ຕົວເຊື່ອມຕໍ່ Micro SIM Card; PUSH PUSH, 6P ຫຼື 6P+1P, H1.35mm KLS1-SIM-069
ຂໍ້ມູນຜະລິດຕະພັນ Micro SIM Card Connector;ຍູ້ PUSH, 6P ຫຼື 6P+1P, H1.35mm, ໂດຍບໍ່ມີການໄປສະນີ. ວັດສະດຸ: Insulator:High Temperature Thermoplastic, UL94V-0 Contact: Copper Alloy,Plated 50U" NiOverall Contact Au 1U Shell:SUS,Plated 50U" Ni Overall Plated 1u"Au Selective Contact Area Electrical: Current Rating: 0.5A Max. Contact Voltage 0.0V. Insulation Resistance: 1000M Min./500VDC ຊ່ວງຄວາມຊຸ່ມຊື່ນສະພາບແວດລ້ອມ: 95% RH Ma...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card 8P, Push PULL, H2.4mm KLS1-SIM-044-8P
ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card 8P, PUSH PULL, H2.4mm Material: Base:Hi-Temp Thermoplastic, UL94V-0.Black. ຂໍ້ມູນຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງ. Shell: Stainless Steel, Gold Plated. ໄຟຟ້າ: Contact Resistance: 50mΩ ປົກກະຕິ, 100Ω Max. ຄວາມຕ້ານທານ insulation:> 1000MΩ / 500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow: 250ºC.5sec.ສູງສຸດ. ການເຊື່ອມໂລຫະດ້ວຍມື: 370ºC.3sec.Max. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ + 105&o...
ຕົວເຊື່ອມຕໍ່ Micro SIM Card 6P, PUSH PULL, H2.4mm KLS1-SIM-044-6P
ຂໍ້ມູນຜະລິດຕະພັນ ຕົວເຊື່ອມຕໍ່ Micro SIM Card 6P, PUSH PULL, H2.4mm Material: Base:Hi-Temp Thermoplastic, UL94V-0.Black. ຂໍ້ມູນຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, ແຜ່ນທອງ. Shell: Stainless Steel, Gold Plated. ໄຟຟ້າ: Contact Resistance: 50mΩ ປົກກະຕິ, 100Ω Max. ຄວາມຕ້ານທານ insulation:> 1000MΩ / 500V DC. 3.Solderability Vapor phase:215ºC.30sec.Max. IR feflow: 250ºC.5sec.ສູງສຸດ. ການເຊື່ອມໂລຫະດ້ວຍມື: 370ºC.3sec.Max. ອຸນຫະພູມການເຮັດວຽກ: -45ºC ~ + 105&o...
ຕົວເຊື່ອມຕໍ່ SIM; PUSH PUSH, 6P + 2P, H1.80mm, ມີໄປສະນີຫຼືບໍ່ມີໄປສະນີ. KLS1-SIM-110
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector;PUSH PUSH,6P+2P,H1.80mm With post or without post.Material:Housing Material: LCP UL94V-0Contact Material: Tin-BronzePackage: Tape and Reel Package ຄຸນລັກສະນະທາງໄຟຟ້າ: ລະດັບແຮງດັນ: 100W 05V ແຮງດັນໄຟຟ້າສູງສຸດ: ACV. AC/1MinuteInsulation resistance: ≥1000ΜΩການຕໍ່ຕ້ານການຕິດຕໍ່: ≤30mΩLife:
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 8P+1P, H1.9mm, ກັບ Post KLS1-SIM-108
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P+1P, H1.9mm, with Post Material: Housing: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell: ໂລຫະປະສົມທອງແດງ. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: ກະພິບທອງ. ພື້ນທີ່ solder: 80u" ຕ່ໍາສຸດ, ໂລຫະປະສົມກົ່ວ Matte plated. ພາຍໃຕ້ແຜ່ນ: 30u" min, Nickel. Shell: 30u" Min, Nickel plated ໂດຍລວມ ພື້ນທີ່ Solder: Gole flash. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ທົນແຮງດັນ: AC500V rms Insulation Resistance: 1000MΩMin, At DC 500V ...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P+1P, H1.9mm, ກັບ Post KLS1-SIM-107
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 1P, H1.9mm, ມີ Post Material: ທີ່ຢູ່ອາໄສ: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell: ໂລຫະປະສົມທອງແດງ / ເຫຼັກກ້າ. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: ກະພິບທອງ. ພື້ນທີ່ solder: 80u" ຕ່ໍາສຸດ, ໂລຫະປະສົມກົ່ວ Matte plated. ພາຍໃຕ້ແຜ່ນ: 30u" min, Nickel. Shell: 30u" Min, Nickel plated ໂດຍລວມ ພື້ນທີ່ Solder: Gole flash. ໄຟຟ້າ: ການຈັດອັນດັບປະຈຸບັນ: 0.5A. ແຮງດັນທີ່ທົນທານ: AC500V rms Insulation Resistance: 1000MΩMin, At...
ຕົວເຊື່ອມຕໍ່ SIM; PUSH PUSH, 6P, H1.85mm KLS1-SIM-106
ຂໍ້ມູນຜະລິດຕະພັນຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P, H1.85mm, ມີ Post Housing: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell:SUS. ສໍາເລັດຮູບ: Gold plated ເທິງພື້ນທີ່ conatct, Tin plated ສຸດຫາງ solder. ພາກທີ No. ລາຍລະອຽດຂອງ PCS/CTN GW(KG) CMB(m3) OrderQty. ຄໍາສັ່ງເວລາ
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-087
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P, H1.85mm, ບໍ່ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" min nickel underplated ສຸດ Allover, ແຜ່ນທອງຄໍາກ່ຽວກັບການຕິດຕໍ່ Arer, 80u" min Tin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover,Gold flash on solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. insulation Resist...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-086
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ບໍ່ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" min Nickel Underplated on Allover, GoldPlating on Contact Arer,80u" min Tin on Solder Tail. Shell: 50u" Nickel Underplated on Allover,Gold Flash onSolder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. Insulation Resis...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-085A
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post Material: Insulator: H-TemperaturePlastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" minnickel underplated onAllover, ແຜ່ນທອງຄໍາກ່ຽວກັບການຕິດຕໍ່ Arer, 80u" minTin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover, GoldFlash on Solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. insulation Resist...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-085
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" min nickel underplated onAllover, ແຜ່ນທອງຄໍາກ່ຽວກັບການຕິດຕໍ່ Arer, 80u" min Tin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover, GoldFlash on Solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. insulation Resi...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post KLS1-SIM-084
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ໂດຍບໍ່ມີການ Post Material: Housing: LCP,UL94V-0 Contact: C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester.Operating Temperature: -45ºCold Contact: -45ºC+ Flash ພື້ນທີ່;ກະພິບສີທອງໃສ່ເທິງຫາງ solder, ດ້ວຍການຕິດຕໍ່ກັນທັງໝົດ 50u" ນາກເກີຕໍ່າ. Shell: 50u" ນາທີ ເຄືອບ nickel ໂດຍລວມ, Gold Flash plated ສຸດ Solder ຫາງ. ພາກທີ ລາຍລະອຽດ PC...
ຕົວເຊື່ອມຕໍ່ຊິມກາດ, PUSH PUSH, 8P+1P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-074B
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P + 1P, H1.85mm, ບໍ່ມີ Post Material: ທີ່ຢູ່ອາໄສ: ອຸນຫະພູມສູງ Thermoplastic, UL94V-0.Black. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. ການປົກຫຸ້ມຂອງ: ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງຫຼືເຫຼັກກ້າ. ແຜ່ນ: ແຜ່ນຮອງ: ນິກເກິລ. ພື້ນທີ່ຕິດຕໍ່: Gold Over Nickel. ພື້ນທີ່ Solder: Tin over Nickel. Shell:G/F Plate Over Nickel On Solder Tails ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V A...
ຕົວເຊື່ອມຕໍ່ຊິມກາດ, PUSH PUSH, 8P+1P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-074A
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 8P + 1P, H1.85mm, ບໍ່ມີ Post Material: Insulator: H-TemperaturePlastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" minnickel underplated onAllover, ແຜ່ນທອງຄໍາກ່ຽວກັບການຕິດຕໍ່ Arer, 80u" minTin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover, GoldFlash on Solder Latch. ໄຟຟ້າ: ການຈັດອັນດັບປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. ຄວາມທົນທານຂອງສນວນ...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P, H1.85mm, ມີ Post ແລະ Out Post KLS1-SIM-073A
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P, H1.85mm, ມີ Post ແລະອອກ Post Electrical: rating ໃນປັດຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. Insulation Resistance: 500M Min.At DC 500V DC Withstanding Voltage: 250V ACrms ສໍາລັບ 1 ນາທີ. Contact Resistance: 100M Max.At 10MA/20mVMAX. ອຸນຫະພູມປະຕິບັດງານ: -45ºC~+85ºCMating ຮອບວຽນ: 5000 ແຊກ. ວັດສະດຸ: Insulator: H-Temperature Plastic, UL94V-0.Black. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15 ...
ຕົວເຊື່ອມຕໍ່ຊິມກາດ, PUSH PUSH, 6P+2P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-064A
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ບໍ່ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" minnickel underplated onAllover, ແຜ່ນທອງຄໍາກ່ຽວກັບການຕິດຕໍ່ Arer, 80u" minTin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover, Gold Flashon Solder Latch. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5A. ລະດັບແຮງດັນ: 5.0 Vrms. ທົນທານຕໍ່ insulation ...
ຕົວເຊື່ອມຕໍ່ຊິມກາດ, PUSH PUSH, 6P+2P, H1.80mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-030C
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.80mm, ໂດຍບໍ່ມີການ Post Material: Housing: LCP,UL94V-0 Contact: C5210R-H,T=0.15 Shell:SUS304,T=0.20 Mylar:Polyester. ສໍາເລັດຮູບ: ຕິດຕໍ່: Gold Flash plated ໃນພື້ນທີ່ຕິດຕໍ່; Flash Gold plated ສຸດ SolderTails, ມີ ContactUnderplated 50u" ນາທີ Nickel. Shell: 50u" min nickel underplated ໂດຍລວມ, GoldFlash plated ສຸດ Solder Tails. ອຸນຫະພູມປະຕິບັດງານ: -45ºC ~ +85ºC Part No. Description ...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P+2P, H1.85mm, ກັບ Post KLS1-SIM-030D
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm; Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" min nickel underplated ສຸດ Allover, ແຜ່ນທອງໃສ່ຕິດຕໍ່ Arer, 80u" min Tin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover,Gold flash on solder Latch. ໄຟຟ້າ: ການປະເມີນປັດຈຸບັນ: 0.5 ລະດັບແຮງດັນ: 5.0 Vrms. ຄວາມຕ້ານທານຂອງສນວນ...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P+2P, H1.85mm, ກັບ Post KLS1-SIM-030F
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P + 2P, H1.85mm, ມີ Post Material: Insulator: H-Temperature Plastic, UL94V-0.Black. ການຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ, T = 0.15mm; Shell: Stainless Steel, T = 0.15mm Finsh: Terminal: 50u" min nickel underplated ສຸດ Allover, ແຜ່ນທອງໃສ່ຕິດຕໍ່ Arer, 80u" min Tin ສຸດ Solder ຫາງ. Shell: 50u" Nickel Underplated on Allover,Gold flash on solder Latch. ໄຟຟ້າ: ການປະເມີນປັດຈຸບັນ: 0.5 ລະດັບແຮງດັນ: 5.0 Vrms. ຄວາມຕ້ານທານຂອງສນວນ...
ຕົວເຊື່ອມຕໍ່ SIM Card, PUSH PUSH, 6P, H1.85mm, ໂດຍບໍ່ມີການໄປສະນີ KLS1-SIM-030E
ຂໍ້ມູນຜະລິດຕະພັນ SIM Card Connector, PUSH PUSH, 6P, H1.85mm, ໂດຍບໍ່ມີວັດສະດຸໄປສະນີ: ເຮືອນ: Hi-Temp Plastic, UL94V-0.Rated. ຕິດຕໍ່: ໂລຫະປະສົມທອງແດງ. Shell:Stainless Steel.SUS 301,T=0.20mm. ແຜ່ນ: ພື້ນທີ່ຕິດຕໍ່: G/F ເຄືອບຫຼາຍກວ່າ 30u" Nickel Solder area: 80u" Tin plated over 30u" nickel. ພາຍໃຕ້ແຜ່ນ: 30u" ຫນ້ອຍ Nickel. Shell: 30u" ຕໍ່າສຸດ, Nickel plated over All, SolderArea: Gold Flash. ໄຟຟ້າ: ອັດຕາປະຈຸບັນ: 0.5 A Dielectric Withstanding Voltage: 250...- English
- French
- German
- Portuguese
- Spanish
- Russian
- Japanese
- Korean
- Arabic
- Irish
- Greek
- Turkish
- Italian
- Danish
- Romanian
- Indonesian
- Czech
- Afrikaans
- Swedish
- Polish
- Basque
- Catalan
- Esperanto
- Hindi
- Lao
- Albanian
- Amharic
- Armenian
- Azerbaijani
- Belarusian
- Bengali
- Bosnian
- Bulgarian
- Cebuano
- Chichewa
- Corsican
- Croatian
- Dutch
- Estonian
- Filipino
- Finnish
- Frisian
- Galician
- Georgian
- Gujarati
- Haitian
- Hausa
- Hawaiian
- Hebrew
- Hmong
- Hungarian
- Icelandic
- Igbo
- Javanese
- Kannada
- Kazakh
- Khmer
- Kurdish
- Kyrgyz
- Latin
- Latvian
- Lithuanian
- Luxembou..
- Macedonian
- Malagasy
- Malay
- Malayalam
- Maltese
- Maori
- Marathi
- Mongolian
- Burmese
- Nepali
- Norwegian
- Pashto
- Persian
- Punjabi
- Serbian
- Sesotho
- Sinhala
- Slovak
- Slovenian
- Somali
- Samoan
- Scots Gaelic
- Shona
- Sindhi
- Sundanese
- Swahili
- Tajik
- Tamil
- Telugu
- Thai
- Ukrainian
- Urdu
- Uzbek
- Vietnamese
- Welsh
- Xhosa
- Yiddish
- Yoruba
- Zulu
- Kinyarwanda
- Tatar
- Oriya
- Turkmen
- Uyghur